Semiconductor device

ABSTRACT

A semiconductor device is provided with: a semiconductor element; and a connecting conductor that electrically connects at least one of an input terminal and an output terminal of the semiconductor element to a connection terminal of an electronic device. In this semiconductor device, the connecting conductor is a block structure.

BACKGROUND OF THE INVENTION

The present invention relates to a semiconductor device, and moreparticularly relates to a semiconductor device that includes asemiconductor module having a semiconductor element and supplies drivepower to an electric motor.

In recent years, electric vehicles provided with an electric motor asits driving power source are becoming popular. Electric vehicles areprovided with a semiconductor device such as a PEU (Power ElectronicUnit) that converts direct-current power supplied from a battery intoalternating-current power and controls the supply of the power to theelectric motor, and also according to need, performs a control such thatalternating-current power generated by a regenerative mechanism isconverted into direct-current power and the power is accumulated in abattery such at a time of braking, for example.

The power electronic unit is provided with a power module that convertsdirect-current power supplied from the battery into alternating-currentpower, and also according to need, converts the alternating-currentpower generated by the regenerative mechanism into direct-current power.Because such power modules are often used in plural, while positioning aplurality of power modules relatively close to each other, an electricwire electrically connecting the plurality of power modules with eachother, and an electric wire electrically connecting the plurality ofpower modules with other constituent members and external devices, arerouted near the power modules. Furthermore, in the power modules,because a relatively high electric current is used, power semiconductorelements such as a Power MOSFET (Metal Oxide Semiconductor Field EffectTransistor) or an IGBT (Insulated Gate Bipolar Transistor) are oftenincorporated as a switching element. Because the operations of suchpower semiconductor elements are accompanied by the generation of alarge amount of heat, heat sinks are mounted on power modules in orderto secure a radiation route.

Japanese Patent Application Laid-open Publication No. 2008-259398relates to a power conversion device, and discloses a configuration inwhich a semiconductor module is fixed to a base board, and a conductionbus bar that provides conduction between the semiconductor module andthe exterior of the device is positioned above the semiconductor modulewhile being included in an input-side terminal board. In this powerconversion device, the semiconductor module has a configuration in whicha semiconductor chip is molded by resin, and the base board functions asa heat sink.

SUMMARY OF THE INVENTION

However, according to studies of the present inventors, with theconfiguration disclosed in Japanese Patent Application Laid-openPublication No. 2008-259398, by the positioning of the conduction busbar that provides conduction between the semiconductor module and theexterior of the device above the semiconductor module while beingincluded in the input-side terminal board, to position the conductionbus bar three-dimensionally above the semiconductor module, althoughhigh-densification of the wiring structure is made possible with thewiring arranged on a small installation area, the input-side terminalboard needs to include a conduction bus bar in any case, so that theterminal board needs to be made of resin as well as being separatelyinstalled as a required constituent member. Additionally, because theterminal board needs to provide conduction with the exterior of thedevice, screw taps, in order to fasten terminals of electric wiring fromthe exterior of the device, needs to be integrally formed in its innerportion, thereby complicating the configuration.

According to further studies of the present inventors, particularly, inview of omitting an additional terminal board, it is preferable that theconnecting conductor that connects output terminals of the semiconductormodule to input terminals of external devices such as an electric motoror condenser has a configuration such that, while exhibiting excellentmechanical properties and electrical properties, mechanically supportsand electrically connects these terminals. In this regard, the desirablemechanical properties of the connecting conductor have strength tomechanically fasten and support these terminals, and strength toreinforce the case. The desirable electrical properties of theconnecting conductor include an excellent conductivity obtained withoutunnecessarily increasing the inductance. Additionally, the desirableproperties of the connecting conductor are those such as its size thatallows for forming of fastening holes, such as screw holes, forfastening these terminals, and radiation that prevents unnecessaryaccumulation of heat. In this regard, although Japanese PatentApplication Laid-open Publication No. 2008-259398 discloses aconfiguration in which the conduction bus bar that provides conductionbetween the semiconductor module and the exterior of the device ispositioned above the semiconductor module while being included in theinput-side terminal board, there is no suggestion about a specificconfiguration in which the connecting conductors, that connect outputterminals of semiconductor modules to input terminals of externaldevices, exhibit excellent mechanical properties and electricalproperties in order to omit an additional terminal board.

The present invention has been achieved in view of the above studies,and an object of the present invention is to provide a semiconductordevice capable of mechanically fastening, supporting, and alsoelectrically connecting an output terminal of a semiconductor element toan input terminal of an external device, and an input terminal of asemiconductor element to a connection terminal of a related device,while omitting an additional terminal board.

To achieve the above object, a first aspect of the present inventionprovides a semiconductor device comprising: a semiconductor element; anda connecting conductor that electrically connects at least one of aninput terminal and an output terminal of the semiconductor element to aconnection terminal of an electronic device. In this aspect, theconnecting conductor is a block structure.

In a second aspect of the present invention, in addition to the firstaspect, the connecting conductor is the block structure thatelectrically connects an output terminal of the semiconductor element toa connection terminal of an external device.

In a third aspect of the present invention, in addition to the secondaspect, the semiconductor device further comprises: a resin case thataccommodates the semiconductor element. In this aspect, the connectingconductor is integrally formed with the case and fixed to the case.

In a fourth aspect of the present invention, in addition to the secondor third aspect, the connecting conductor includes a screw fasteningunit that fastens the output terminal or the connection terminal.

In a fifth aspect of the present invention, in addition to any one ofthe second to fourth aspects, the connecting conductor is made of analuminum material.

A sixth aspect of the present invention, in addition to the firstaspect, further comprises: a condenser that is electrically connected tothe semiconductor element. In this aspect, the connecting conductorincludes a plurality of connecting conductors, and the plurality ofconnecting conductors electrically connect an input terminal of thesemiconductor element to a connection terminal of the condenser.

In a seventh aspect of the present invention, in addition to the sixthaspect, the plurality of connecting conductors include a firstconnecting conductor and a second connecting conductor that is arrangedto deviate from the first connecting conductor.

In an eighth aspect of the present invention, in addition to the sixthor seventh aspect, each of the plurality of connecting conductorsincludes a screw fastening unit that fastens the input terminal or theconnection terminal.

In a ninth aspect of the present invention, in addition to any one ofthe sixth to eighth aspects, the plurality of connecting conductors aremade of an aluminum material.

The semiconductor device according to the first aspect of the presentinvention includes a connecting conductor that electrically connects atleast one of an input terminal and an output terminal of a semiconductorelement to a connection terminal of an electronic device, whereinbecause the connecting conductor is a block structure, while omitting anadditional terminal board, it is possible to mechanically fasten,support, and also electrically connect at least one of the inputterminal and the output terminal of the semiconductor element to theconnection terminal of the electronic device.

The semiconductor device according to the second aspect of the presentinvention includes a connecting conductor that electrically connects anoutput terminal of the semiconductor element to a connection terminal ofan external device, wherein because the connecting conductor is a blockstructure, while omitting an additional terminal board, it is possibleto mechanically fasten, support, and also electrically connect theoutput terminal of the semiconductor element to an input terminal of theexternal device.

The semiconductor device according to the third aspect of the presentinvention further includes a resin case that accommodates thesemiconductor element, wherein because the connecting conductor isintegrally formed with the case and fixed to the case, while reinforcingthe case and improving its rigidness, it is possible to mechanicallyfasten, support, and also electrically connect the output terminal ofthe semiconductor element to an input terminal of an external device.

In the semiconductor device according to the fourth aspect of thepresent invention, because a screw fastening unit that fastens theoutput terminal or the connection terminal is arranged on the connectingconductor, the output terminal of the semiconductor element and an inputterminal of an external device can be mechanically and securelysupported and can be electrically and securely connected with a simpleconfiguration.

In the semiconductor device according to the fifth aspect of the presentinvention, because the connecting conductor is made of an aluminummaterial, while balancing various properties of the connecting conductorsuch as mechanical properties, electrical properties, and the sizethereof, it is possible to mechanically and securely support andelectrically and securely connect the output terminal of thesemiconductor module to an input terminal of an external device.

The semiconductor device according to the sixth aspect of the presentinvention includes a plurality of connecting conductors thatelectrically connect the input terminal of the semiconductor element tothe connection terminal of the condenser, wherein because each of theplurality of connecting conductors is a block structure, while omittingan additional terminal board, it is possible to mechanically fasten,support, and also electrically connect the input terminal of thesemiconductor element to a connection terminal of a related device.

In the semiconductor device according to the seventh aspect of thepresent invention, because the plurality of connecting conductorsincluding a first connecting conductor and a second connecting conductorthat is arranged to deviate from the first connecting conductor, whileomitting an additional terminal board, when mechanically fastening,supporting, and also electrically connecting the input terminal of thesemiconductor element to a connection terminal of a related device, oneof connecting conductors is capable of being positioned not to interferewith a fastening tool of another connecting conductor or the like, andwithout using any special tools or fastening sequence, it is capable ofmechanically fastening, supporting, and also electrically connecting theinput terminal of the semiconductor element to the connection terminalof the related device.

In the semiconductor device according to the eighth aspect of thepresent invention, because a screw fastening unit that fastens an inputterminal or a connection terminal is provided on each of the pluralityof connecting conductors, the input terminal of the semiconductorelement and a connection terminal of a related device can bemechanically and securely fastened and supported and can be electricallyand securely connected with a simple configuration.

In the semiconductor device according to the ninth aspect of the presentinvention, because the plurality of connecting conductors are made of analuminum alloy, while balancing various properties of the connectingconductor such as mechanical properties, electrical properties, and thesize thereof, it is possible to mechanically and securely fasten andsupport and to electrically and securely connect the input terminal ofthe semiconductor element to a connection terminal of a related device.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an exploded perspective view showing a power electronic unitaccording to a first embodiment of the present invention, in a statewhere one of its power modules is assembled.

FIG. 2A is a front view of the power electronic unit according to thefirst embodiment as viewed along the direction of an arrow A in FIG. 1.

FIG. 2B is a side view of the power electronic unit according to thefirst embodiment as viewed along the direction of an arrow B in FIG. 1.

FIG. 2C is a back view of the power electronic unit according to thefirst embodiment as viewed along the direction of an arrow C in FIG. 1.

FIG. 3 is an enlarged detailed cross-sectional view showing the powerelectronic unit according to the first embodiment cut along across-sectional line S3-S3 in FIG. 2A and FIG. 2C, where for eachfastening member in FIG. 3 only heads thereof are shown for convenience.

FIG. 4 is an enlarged perspective view of related portions of an outputconnecting conductor of the power electronic unit according to the firstembodiment.

FIG. 5 is an exploded perspective view showing a power electronic unitaccording to a second embodiment of the present invention, in a statewhere one of its power modules is assembled.

FIG. 6 is an enlarged detailed cross-sectional view of the powerelectronic unit according to the second embodiment, and is a drawingthat corresponds to FIG. 3 in terms of position.

FIG. 7A is an enlarged perspective view of related portions of an inputconnecting conductor of the power electronic unit according to thesecond embodiment.

FIG. 7B is an enlarged vertical cross-sectional view of the inputconnecting conductor cut along a cross-sectional line S4-S4 in FIG. 6.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Preferred embodiments of a semiconductor device according to the presentinvention will be explained below in detail with reference to thedrawings as needed, while taking a power electronic unit as an example.In the drawings, the x-axis, the y-axis, and the z-axis form athree-axis orthogonal coordinate system, where the z-axis extends in avertical direction, and the x-y plane extends horizontally.

[Configuration of Control System]

A configuration of a control system to which a power electronic unitserving as a semiconductor device according to the present embodiment isapplied is explained first in detail.

Typically, a power electronic unit 1 according to the present embodimentshown in FIG. 1 to FIG. 4 incorporates, although not shown, an electricmotor that is a driving power source and a battery that is a secondarycell, and the power electronic unit 1 is incorporated in an electric carprovided with a regenerative mechanism which generates regenerativepower at a time of deceleration.

The power electronic unit 1, in an electric vehicle, each individually,or under the control of a control device (not shown) that controlsoverall the electric motor, the battery, and the regenerative mechanism,is capable of controlling the supply of drive power from the battery tothe electric motor, as well as being capable of controlling the supplyof regenerative power from the regenerative mechanism to the battery.For example, when using a three-phase alternating current as the drivecurrent of the electric motor, the power electronic unit 1 has afunction of a DC/AC converter that steadily converts the direct currentsupplied from the battery into a three-phase alternating currentconsisting of a U-phase, a V-phase, and a W-phase and supplies thisalternating current to the electric motor, along with a function of anAC/DC converter that steadily converts the regenerative alternatingcurrent generated by the regenerative mechanism into a direct currentand supplies this direct current to the battery. Furthermore, accordingto need, the power electronic unit 1 may only have a DC/AC converterfunction of steadily converting the direct current supplied from thebattery into an alternating current, and supplies this alternatingcurrent to the electric motor.

The electric motor, for example, is a three-phase brushless electricmotor that operates with a three-phase alternating power supply, andsupplies the drive power that drives the electric vehicle.

The battery is a typical nickel-metal-hydride type or lithium-ion typesecondary cell, and while supplying the electric motor and otherassisting devices with required power, stores the regenerative powergenerated from the regenerative mechanism.

Furthermore, the power electronic unit 1 can be applied to a hybridvehicle that incorporates an engine such as an internal-combustionengine in addition to the electric motor, or a fuel cell vehicle thatincorporates a fuel cell. In a case where the power electronic unit 1 isapplied to a hybrid vehicle, the power electronic unit 1 is capable ofcontrolling the supply of drive power from the battery to the electricmotor, as well as controlling the supply of regenerative power from theregenerative mechanism to the battery and the supply of generated powerfrom the generator as an assisting device of the engine to the battery.Furthermore, in a case where the power electronic unit 1 is applied to afuel cell vehicle, the power electronic unit 1 is capable of controllingthe supply of drive power from the fuel cell to the electric motor, aswell as controlling the supply of regenerative power from theregenerative mechanism to the battery. Further, in a case where thepower electronic unit 1 is applied to either one of an electric vehicle,a hybrid vehicle, or a fuel cell vehicle, the power electronic unit 1is, according to need, capable of controlling the supply of regenerativepower from the electric motor to the battery such as at a time ofbraking.

[Overall Configuration of Power Electronic Unit]

Next, as an example, the overall configuration of the power electronicunit 1 according to the present embodiment, in a case where mainly thedirect current from the battery is converted to a three-phasealternating current and supplied to the electric motor, is explained indetail.

As shown in FIG. 1 to FIG. 4, the power electronic unit 1 is mainlyprovided with a first semiconductor module 2 with first semiconductorelements 23(U), 24(V), and 25(W) having switching functions, positionedadjacent to each other in the x-axis direction and mounted on a surface21A which is the inner-side surface of a first cooling member 21, asecond semiconductor module 3 with second semiconductor elements 33(U),34(V), and 35(W) having switching functions, positioned adjacent to eachother in the x-axis direction and mounted on a surface 31A which is theinner-side surface of a second cooling member 31, a case 7 having asidewall 71 which extends in the vertical direction and is typicallyrectangular cylindrical, and while forming an internal space Ssurrounded by the sidewall 71, has a first opening 7H1 and a secondopening 7H2, formed on opposite sides of each other on the sidewall 71at both ends in the vertical direction, which open the internal space Sto the outer area, and a circuit board 55 that is typically of a flatrectangular shape and is a control circuit board mounted with acontrolling IC (Integrated Circuit) 551 that controls the switchingoperations of the first semiconductor elements 23(U) to 25(W) and thesecond semiconductor elements 33(U) to 35(W). These constituent membersare, in the vertical direction, substantially layered along the sameaxis.

In the power electronic unit 1, the first semiconductor elements 23(U)to 25(W) are accommodated in the case 7 as to be inserted into theinternal space S of the case 7 through the first opening 7H1 of the case7, and by adjoining one side of the first cooling member 21, the surface21A, with the bottom end of the case 7 while exposing a surface 21Bwhich is the other outer-side surface of the first cooling member 21 tooutside of the case 7, the first semiconductor module 2 is mounted inthe case 7 in a state where the first opening 7H1 is closed by the firstcooling member 21.

Similarly, in the power electronic unit 1, the second semiconductorelements 33(U) to 35(W) are accommodated in the case 7 as to be insertedinto the internal space S of the case 7 through the second opening 7H2of the case 7, and by adjoining one side of the second cooling member31, the surface 31A, with the upper end of the case 7 while exposing asurface 31B which is the other outer-side surface of the first coolingmember 31 to outside of the case 7, the second semiconductor module 3 ismounted in the case 7 in a state where the second opening 7H2 is closedby the second cooling member 31.

The circuit board 55, typically a PCB (Printed Circuit Board), whilebeing electrically connected to each printed wiring, is mounted with, inaddition to the controlling IC 551, various devices such as a resistordevice (not shown), or a condenser on the front surface (the upper-sidesurface), along with being a control circuit board on which a total ofthree current sensors 552, corresponding to the front surfaces of atotal of three protruding portions 553, are mounted on. The controllingIC 551 performs the controlling of the switching operations of the firstsemiconductor elements 23(U) to 25(W) and the second semiconductorelements 33(U) to 35(W). Furthermore, each of the current sensors 552 isa non-contact type current sensor, typically a coreless current sensorhaving a Hall element, and individually, for the U-phase alternatingcurrent, the V-phase alternating current, and the W-phase alternatingcurrent, detects corresponding magnetic fields generated and convertsthese currents to current signals.

This circuit board 55, within the internal space S of the case 7, inbetween the first semiconductor module 2 and the second semiconductormodule 3, in such a manner that each of the first semiconductor elements23(U) to 25(W) thereof and the second semiconductor elements 33(U) to35(W) thereof are appropriately separated, is mounted in the case 7 tobe parallel with the horizontal surface.

Specifically, the circuit board 55, in between the first opening 7H1 andthe second opening 7H2 of the case 7, in such a manner that the rearsurface (the lower-side surface) thereof is opposite to one side of thefirst cooling member 21, the surface 21A, and the front surface thereofis opposite to one side of the second cooling member 31, the surface31A, is positioned and mounted in parallel in the vertical direction inrelation to the first cooling member 21 and the second cooling member31. With such a configuration, the circuit board 55, while efficientlyusing the internal space S, is arranged with appropriate spacing ofrequired distances from the first semiconductor elements 23(U) to 25(W)and the second semiconductor elements 33(U) to 35(W). Due to this, thecircuit board 55, the controlling IC 551, and its control current pathscan be distanced from the first semiconductor elements 23(U) to 25(W)and the second semiconductor elements 33(U) to 35(W) themselves andcurrent paths where relatively high currents flow upon their operation,reducing the effects of excess heat and electromagnetic waves on thecircuit board 55, for example, and improving the durability of thesemembers.

When the circuit board 55 is at a midpoint between the first opening 7H1and the second opening 7H2 of the case 7, or the circuit board 55 ispositioned at a midpoint between the first semiconductor module 2 andthe second semiconductor module 3, while appropriately balancingdistancing of the circuit board 55 from the first semiconductor elements23(U) to 25(W) and the second semiconductor elements 33(U) to 35(W), theentire configuration of the power electronic unit 1 can be made morecompact, and is further preferable.

Furthermore, the power electronic unit 1 is provided with, all of whichare mounted in the case 7, one first connecting conductor 81(N), onesecond connecting conductor 82(P), and a total of three third connectingconductors 83(U), 84(V), and 85(W).

The first connecting conductor 81(N) and the second connecting conductor82(P), when supplying power to the electric motor, function as a powerinput wire when connected electrically to the battery and power issupplied from the battery. Specifically, the first connecting conductor81(N) is electrically connected to a minus terminal of the battery, andthe second connecting conductor 82(P) is electrically connected to aplus terminal of the battery. Furthermore, when charging the battery,the first connecting conductor 81(N) and the second connecting conductor82(P) function as an output wire.

The third connecting conductors 83(U), 84(V), and 85(W), whenelectrically connected to the electric motor and supplying power to theelectric motor, function as an output wire for the three-phasealternating current. Specifically, the third connecting conductor 83(U)is electrically connected to the U-phase drive current input terminal ofthe electric motor, the third connecting conductor 84(V) is electricallyconnected to the V-phase drive current input terminal of the electricmotor, and the third connecting conductor 85(W) is electricallyconnected to the W-phase drive current input terminal of the electricmotor. Furthermore, when regenerative power is input from theregenerative mechanism, the third connecting conductors 83(U), 84(V),and 85(W) function as an input wire.

Furthermore, the power electronic unit 1 includes a total of twocondensers, namely a first condenser 91 and a second condenser 92, whichare mounted in the case 7 and accommodated in the internal space S. Thefirst condenser 91 has connection terminals 911 and 912, and the secondcondenser 92 has connection terminals 921 and 922. That is, the firstcondenser 91 and the second condenser 92 have an identical configurationto each other including its electrostatic capacity and shape, except forthe arrangement position of the connection terminals 921 and 922 and thearrangement position of the connection terminals 911 and 912 beingdifferent in the vertical direction.

Each of the first condenser 91 and the second condenser 92 iselectrically connected in parallel with each other between the firstconnecting conductor 81(N) and the second connecting conductor 82(P),along with being electrically connected in parallel with respect to thefirst semiconductor elements 23(U) to 25(W) and the second semiconductorelements 33(U) to 35(W), and when supplying power to the electric motor,function as smoothing condensers that smooth the direct current from thebattery. Furthermore, when charging the battery, the first condenser 91and the second condenser 92 function as smoothing condensers that smooththe direct current from the first semiconductor elements 23(U) to 25(W)and the second semiconductor elements 33(U) to 35(W). Furthermore,according to need, the first condenser 91 and the second condenser 92may be unified and a single condenser may be used, or the number ofcondensers may be increased and three or more condensers may be used.

As described above, with the power electronic unit 1, where on both thetop and bottom ends of the cylindrical case 7, the first semiconductormodule 2 and the second semiconductor module 3 are mountedcorrespondingly to each other, and a layered structure where the circuitboard 55 is positioned in between the first semiconductor module 2 andthe second semiconductor module 3 in the internal space S of the case 7is used, and the third connecting conductors 83(U), 84(V), and 85(W) areused, while downsizing by making compact the configuration of the entiredevice through efficient use of the internal space S, the U-phase drivecurrent input terminal of the electric motor is electrically connectedto the third connecting conductor 83(U), the V-phase drive current inputterminal of the electric motor is electrically connected to the thirdconnecting conductor 84(V), and the W-phase drive current input terminalof the electric motor is electrically connected to the third connectingconductor 85(W).

In addition, in the power electronic unit 1, as the first connectingconductor 81(N) and the second connecting conductor 82(P) are used,while downsizing by making compact the configuration of the entiredevice through efficient use of the internal space S, the minus terminalof the battery is electrically connected to the first connectingconductor 81(N), the plus terminal of the battery is electricallyconnected to the second connecting conductor 82(P), while meanwhile, thefirst condenser 91 and the second condenser 92 are each electricallyconnected in a parallel manner with each other between the firstconnecting conductor 81(N) and the second connecting conductor 82(P),along with being electrically connected in a parallel manner in relationto the first semiconductor elements 23(U) to 25(W) and the secondsemiconductor elements 33(U) to 35(W).

Respective constituent elements of the power electronic unit 1 areexplained below in detail.

[Configuration Related to Semiconductor Module]

As shown in FIG. 1 to FIG. 4, the first semiconductor module 2 isprovided with the first cooling member 21, the first semiconductorelements 23(U), 24(V), and 25(W), and additionally provided with a frame41, a pressing member 42, and a circuit board 51.

The first cooling member 21 that is typically made of an aluminum alloyand fixed to the case 7 has a function of a heat sink that acquires heatgenerated by the operations of the first semiconductor elements 23(U) to25(W) and releases this to the outer side, that of a mounting member onwhich the first semiconductor elements 23(U) to 25(W) are mounted on,and that of a lid that closes the first opening 7H1 of the case 7, whilebeing a part of the structural body of the power electronic unit 1.

One side of the first cooling member 21, the surface 21A, is configuredas a flat plane having no differences in level, and on the other side,the surface 21B, on the opposite side, a plurality of radiation fins 215for increasing the radiation efficiency are arranged in a systematicallylined shape. On the first cooling member 21, penetration holes 211 forattachments of sorts and fastening holes having female screw threads arearranged, and it is preferable that these are closed by plugs (notshown) according to need, to prevent entry of water and dust. The sizeof the first cooling member 21 in the horizontal direction is largerthan the individual sizes of the first semiconductor module 2, thesecond semiconductor module 3, and the circuit board 55 in thehorizontal direction.

The first semiconductor element 23(U) of the first semiconductor module2 has a low-side switching function of generating, among the three-phasealternating current, the U-phase low voltage side alternating current.The first semiconductor element 23(U) is provided with a semiconductorchip (not shown), a sealing body (for which reference numeral is notassigned), which is a package that seals the semiconductor chip, a firstpower input terminal 231 which is a board shape extending from one end(the end in the positive y-axis direction) of the sealing body in ashape of a gull-wing, a first output terminal 232 which is a board shapeextending from the other end (the end in the negative y-axis direction)of the sealing body in the shape of a gull-wing, and connection leads(for which reference numeral is not assigned), which extend upward fromone end and the other end of the sealing body.

As for the semiconductor chip, a power semiconductor element, such as anIGBT or a Power MOSFET having a high-voltage characteristic, is used.For the sealing body, typically a resin sealing body such as an epoxyresin sealing body is used. The inner side of the first power inputterminal 231 is electrically connected to the input terminal of thesemiconductor chip within the sealing body, and the outer side of thefirst power input terminal 231 is electrically connected to the firstconnecting conductor 81(N). The inner side of the first output terminal232 is electrically connected to the output terminal of thesemiconductor chip within the sealing body, and the outer side of thefirst output terminal 232 is electrically connected to the thirdconnecting conductor 83(U).

As for the first semiconductor module 2, as the other firstsemiconductor element 24(V) and first semiconductor element 25(W) have aconfiguration identical to the first semiconductor element 23(U),explanations of identical configurations are abbreviated or omitted forconvenience. Specifically, for the first semiconductor element 24(V) andthe first semiconductor element 25(W), a product of the same type as thefirst semiconductor element 23(U), typically a product of the same modelnumber, is used, and the first semiconductor elements 23(U) to 25(W) areinterchangeable.

That is, the first semiconductor element 24(V) has a low-side switchingfunction of generating, among the three-phase alternating current, theV-phase low voltage side alternating current, and similarly to the firstsemiconductor element 23(U), is provided with a first power inputterminal 241, a first power output terminal 242 and the like, which areelectrically connected correspondingly to the first connecting conductor81(N), the third connecting conductor 84(V) and the like. Furthermore,the first semiconductor element 25(W) has a low-side switching functionof generating, among the three-phase alternating current, the W-phaselow voltage side alternating current, and similarly to the firstsemiconductor element 23(U), is provided with a first power inputterminal 251, a first power output terminal 252 and the like, which areelectrically connected correspondingly to the first connecting conductor81(N), the third connecting conductor 85(W) and the like. Furthermore,according to need, the first semiconductor elements 23(U) to 25(W) maybe unified, and a single semiconductor element may be used.

As shown particularly in FIG. 1, FIG. 3, and FIG. 4, the three firstsemiconductor elements 23(U) to 25(W) are attached to the frame 41, andin this state of being attached to the frame 41, are mounted on one sideof the first cooling member 21, the surface 21A. The frame 41 isprovided with a frame body 411, and a total of two positioning pins 412and 413 arranged upright on the frame body 411. Furthermore, in FIG. 3,because the positioning pin 413 is in front on the viewing side, this isshown by an imaginary dashed line.

The frame body 411, while maintaining the positioning of the firstsemiconductor elements 23(U) to 25(W) adjacently arranged in the x-axisdirection parallel to the horizontal surface, positions the first powerinput terminals 231 to 251 to be parallel to each other and aligned inthe x-axis direction, and positions the first output terminals 232 to252 to each correspond, at the opposite side, with the first power inputterminals 231 to 251 by being parallel to each other and aligned in thex-axis direction. For the frame body 411, typically an injection moldedresin frame body is used. The positioning pins 412 and 413 are typicallyintegrally formed with the frame body 411 and extend in the verticaldirection. Furthermore, the frame body 411 and positioning pin 412 and413 may be made of metal if an increase of weight is allowed, and theseelements may be separated if complication of the configuration isallowed.

As shown particularly in FIG. 1 and FIG. 3, on the frame body 411 of theframe 41, a pressing member 42 is fixed and attached. The pressingmember 42, while pressing the first semiconductor elements 23(U) to25(W) onto the frame body 411 with an appropriate pressure, interposesthe first semiconductor elements 23(U) to 25(W) between the frame body411 and one side of the first cooling member 21, the surface 21A. Thepressing member 42 is fixed onto the frame body 411 using a fasteningmember such as screws (for which reference numeral is not assigned). Thepressing member 42 is typically made of a metal material such asstainless steel having elasticity and superior in workability of such asmachine processing. On the pressing member 42, there is arranged a ribhaving a U-shaped cross-section for assigning a desired spring constant,for example, between a portion that is attached to the frame body 411and a portion pressing the first semiconductor elements 23(U) to 25(W).

As shown particularly in FIG. 1 and FIG. 3, the frame 41, in a statewhere the first semiconductor elements 23(U) though 25(W) are in contactwith an insulation sheet 22 mounted on one side of the first coolingmember 21, the surface 21A, sharing a fastening member such as screws(for which reference numeral is not assigned), for the pressing member42 or circuit board 51, is fixed onto one side of the first coolingmember 21, the surface 21A. The insulation sheet 22, while acting as asecure electronic insulation between the first cooling member 21 and thefirst semiconductor elements 23(U) to 25(W), has heat conductivitycapable of efficiently conducting the heat generated by the operationsof the first semiconductor elements 23(U) to 25(W) to the first coolingmember 21. For the insulation sheet 22, typically a silicone rubbersheet is used.

As shown particularly in FIG. 1 and FIG. 3, the circuit board 51 is,typically of a flat rectangular shape, and within the internal space Sof the case 7, mounted in the case 7 between the first semiconductorelements 23(U) to 25(W) and the circuit board 55. The circuit board 51is a drive circuit board implemented with a driving IC 511 that drivesand operates the switching of the first semiconductor elements 23(U) to25(W), based on control signals transmitted from the controlling IC 551of the circuit board 55 for controlling the switching operations of thefirst semiconductor elements 23(U) to 25(W). Furthermore, the driving IC511 may be divided into a plurality of driving ICs that individuallydrive the first semiconductor elements 23(U) to 25(W).

Specifically, the circuit board 51 has a pair of positioning holes 512that conform to the positioning pins 412 and 413 of the frame 41, andwhile being positioned on the frame 41 by insertion of the positioningpins 412 and 413 through the corresponding positioning holes 512, thecircuit board 51 is mounted parallel to the horizontal surface onto theframe 41 using a fastening member such as screws (for which referencenumeral is not assigned). At this time, the rear surface of the circuitboard 55 and the front surface (the upper-side surface) of the circuitboard 51 are parallel to and opposite to each other.

The circuit board 51, typically a PCB, while being electricallyconnected to each printed wiring, is mounted with, in addition to thedriving IC 511, various devices such as a resistor device (not shown),or a condenser on the front surface, and has connection leads (for whichreference numeral is not assigned), which extend upwards from the wiringboard and are given the shape of a kink. The circuit board 51electrically connects these connection leads to the circuit board 55through connectors (not shown) mounted on the front surface of thecircuit board 55, and also gets electrically connected to the connectionleads of the first semiconductor elements 23(U) to 25(W). That is, thecircuit board 51, through its connection leads, receives control signalstransmitted from the controlling IC 551 of the circuit board 55, and bytransmitting drive signals from the driving IC 511, that operates basedon the control signals, to the first semiconductor elements 23(U) to25(W), through the connection leads of the first semiconductor elements23(U) to 25(W), operates the switching of the first semiconductorelements 23(U) to 25(W).

Meanwhile, as shown in FIG. 1 to FIG. 4, although the secondsemiconductor module 3 is attached at a position higher than the firstsemiconductor module 2 and in an upside-down manner as compared to thefirst semiconductor module 2, and its usage differs from the firstsemiconductor module 2, as it has a configuration identical to the firstsemiconductor module 2, explanations of identical configurations areabbreviated or omitted for convenience. Specifically, the secondsemiconductor module 3 is provided with a second cooling member 31,second semiconductor elements 33(U), 34(V), and 35(W), as well as beingprovided with such as a frame 43, a pressing member 44, and a circuitboard 52.

That is, the second cooling member 31 has a configuration identical tothat of the first cooling member 21, and similarly to the first coolingmember 21, has a surface 31A on one side which is a flat plane, asurface 31B on the other side where a radiation fin 315 is arranged, andpenetration holes 311. Furthermore, while having a configurationidentical to that of the first semiconductor element 23(U), the secondsemiconductor element 33(U) has a high-side switching function ofgenerating, among the three-phase alternating current, the U-phase highvoltage side alternating current, and similarly to the firstsemiconductor element 23(U), is provided with a second power inputterminal 331 and a second power output terminal 332, which areelectrically connected correspondingly to the second connectingconductor 82(P), the third connecting conductor 83(U) and the like.Further, while having a configuration identical to that of the secondsemiconductor element 33(U), the second semiconductor element 34(V) hasa high-side switching function of generating the V-phase high voltageside alternating current, and similarly to the second semiconductorelement 33(U), is provided with a second power input terminal 341 and asecond power output terminal 342, which are electrically connectedcorrespondingly to the second connecting conductor 82(P), the thirdconnecting conductor 83(U) and the like. Further, while having aconfiguration identical to that of the second semiconductor element33(U) the second semiconductor element 35(W) has a high-side switchingfunction of generating, among the three-phase alternating current, theW-phase high voltage side alternating current, and similarly to thefirst semiconductor element 23(U), is provided with a second power inputterminal 351 and a second power output terminal 352, which areelectrically connected correspondingly to the second connectingconductor 82(P), the third connecting conductor 85(W) and the like.

The frame 43 has a configuration identical to that of the frame 41, andis provided with a frame body 431, and a total of two positioning pins432 and 433 arranged upright on the frame body 431. Furthermore, thepressing member 44 has a configuration identical to that of the pressingmember 42, and is fixed and attached onto the frame body 431 of theframe 43. Further, an insulation sheet 32 having a configurationidentical to that of the insulation sheet 22 is arranged on one side ofthe second cooling member 31, the surface 31A. Further, the circuitboard 52 having a configuration identical to that of the circuit board51 is a drive circuit board implemented with a driving IC 521 thatdrives and operates the switching of the second semiconductor elements33(U) to 35(W), and is arranged with a pair of positioning holes 522which conform to the positioning pins 432 and 433 of the frame 43.

The circuit board 55 that is positioned between the circuit board 51 andthe circuit board 52 has a total of four positioning holes 555 whichconform to the positioning pins 412 and 413 of the frame 41, and thepositioning pins 432 and 433 of the frame 43.

That is, the circuit board 55, by insertion of the positioning pins 412,413, 432, and 433 through the corresponding positioning holes 555, ispositioned against the frames 41 and 43, together with the circuit board51 positioned on the frame 41 by the positioning pins 412 and 413inserted through the positioning holes 512, and the circuit board 52positioned on the frame 43 by the positioning pins 432 and 433 insertedthrough the positioning holes 522, and is mounted in the case 7 using afastening member such as screws (for which reference numeral is notassigned).

Furthermore, as described above, in the power electronic unit 1, byconfiguring the semiconductor module to be divided into twosemiconductor modules, the first semiconductor module 2 and the secondsemiconductor module 3, which have an identical configuration and areinterchangeable, positioning these opposite of each other on the top andbottom ends of the case 7, and using the third connecting conductors83(U), 84(V), and 85(W), while assembly is simplified, the first outputterminals 232 to 252 of the first semiconductor elements 23(U) to 25(W)are electrically connected to the third connecting conductors 83(U) to85(W), the second output terminals 332 to 352 of the secondsemiconductor elements 33(U) to 35(W) are electrically connected to thethird connecting conductors 83(U) to 85(W), and the third connectingconductors 83(U) to 85(W) are shared with the first semiconductorelements 23(U) to 25(W) and the second semiconductor elements 33(U) to35(W).

In addition, in the power electronic unit 1, as the first connectingconductor 81(N) and the second connecting conductor 82(P) are used,while assembly is simplified, the first power input terminals 231 to 251of the first semiconductor elements 23(U) to 25(W) are electricallyconnected to the first connecting conductor 81(N), and the second powerinput terminals 331 to 351 of the second semiconductor elements 33(U) to35(W) are electrically connected to the second connecting conductor82(P).

[Configuration Related to Case]

As shown in FIG. 1 to FIG. 4, the case 7 is typically integrally formedand made of a resin such as PPS (Polyphenylene Sulfide) resin. That is,the sidewall 71 of the case 7, extending in the vertical direction istypically obtained as an integrally formed rectangular shapedcylindrical piece, and while forming the internal space S on its inside,on opposite sides of each other on the sidewall 71 at both ends in thevertical direction, the second opening 7H2 and the first opening 7H1,which open the internal space S to the outer area, are formed at bothends.

As shown in FIG. 1 while omitting reference numerals thereof, on thefour corners on the upper end of the sidewall 71, fastening holes (forwhich reference numeral is not assigned) having female screw threads arearranged, and using a fastening member, such as screws (for whichreference numeral is not assigned), with these fastening holes, thesecond cooling member 31 of the second semiconductor module 3 is fixed,closing the second opening 7H2. Furthermore, although not shown in thedrawings, fastening holes having female screw threads are also arrangedon the four corners on the bottom end of the sidewall 71, and using afastening member, such as screws (for which reference numeral is notassigned), with these fastening holes, the first cooling member 21 ofthe first semiconductor module 2 is fixed, closing the first opening7H1. Furthermore, in such a case, in order to improve the positioningwhen mounting the first cooling member 21 and the second cooling member31, in correspondence between both the top and bottom ends of thesidewall 71 and the first cooling member 21 and the second coolingmember 31, an interlocking structure of concave and convex shapes, suchas a combination of protrusions and matching grooves, may be arranged.

The first connecting conductor 81(N) and the second connecting conductor82(P) are attached onto the case 7, and the third connecting conductors83(U) to 85(W) are integrally formed with the sidewall 71 of the case 7.Accordingly, the first connecting conductor 81(N), the second connectingconductor 82(P), and the third connecting conductors 83(U) to 85(W),correspondingly through one penetration hole 711, one penetration hole712, and a total of three penetration portions 713, arranged on thesidewall 71, extend outside of the case 7. As a sealing member isarranged in the gap between the first connecting conductor 81(N) and thesecond connecting conductor 82(P), and the corresponding penetrationholes 711 and 712, while the third connecting conductors 83(U) to 85(W)are in close contact with the corresponding penetration portions 713,the internal space S is sealed.

Specifically, as shown in FIG. 1 and FIG. 2A to FIG. 2C, the secondconnecting conductor 82(P) extends outside, penetrating the side of thesidewall 71 parallel to the y-z plane and on the positive x-axisdirection, through the penetration hole 712, forming a protruding end,and this protruding end acts as a second power input terminal 73 of thepower electronic unit 1. Specifically, the second power input terminal73 is electrically connected to the plus terminal of the battery.Furthermore, on the side of the sidewall 71 parallel to the y-z planeand on the positive x-axis direction, there is arranged a controllingconnector 75 having control terminals which are electrically connectedto the circuit board 55.

As shown in FIG. 1, FIG. 2A, and FIG. 2C, the first connecting conductor81(N) extends outside, penetrating the side of the sidewall 71 parallelto the y-z plane and on the negative x-axis direction, through thepenetration hole 711, forming a protruding end, and this protruding endacts as a first power input terminal 72 of the power electronic unit 1.Specifically, the first power input terminal 72 is electricallyconnected to the minus terminal of the battery.

As shown in FIG. 1, FIG. 2B, and FIG. 3, the third connecting conductors83(U) to 85(W) individually extend outside, penetrating the side of thesidewall 71 parallel to the x-z plane and on the negative y-axisdirection, through the corresponding penetration holes 713, formingprotruding ends arranged in parallel in the x-axis direction, and theseprotruding ends act as output terminals 74 of the power electronic unit1. Specifically, the output terminal 74 corresponding to the thirdconnecting conductor 83(U) is electrically connected to the U-phasedrive current input terminal of the electric motor, the output terminal74 corresponding to the third connecting conductor 84(V) is electricallyconnected to the V-phase drive current input terminal of the electricmotor, and the output terminal 74 corresponding to the third connectingconductor 85(W) is electrically connected to the W-phase drive currentinput terminal of the electric motor.

In detail, the third connecting conductors 83(U) to 85(W) areinsert-molded to the case 7, and formed integrally with the sidewall 71of the case 7. Specifically, the third connecting conductors 83(U) to85(W), when molding the case 7, are each located beforehand inpredetermined positions within the mold, and simultaneously as thesidewall 71 is molded during the molding of the case 7, these areadhered and fixed to the sidewall 71 in the penetration portions 713formed in the sidewall 71.

Furthermore, as described above, in the power electronic unit 1, as thefirst semiconductor module 2 and the second semiconductor module 3 arecorrespondingly mounted on both the top and bottom ends of thecylindrical case 7, and the first connecting conductor 81(N), the secondconnecting conductor 82(P), and the third connecting conductors 83(U) to85(W) are correspondingly extended outside of the case 7 in such amanner that they do not interfere with each other, while meanwhile thethird connecting conductors 83(U) to 85(W) are integrally formed withthe case 7 and are adhered and fixed to the sidewall 71 in thepenetration portions 713 formed in the sidewall 71, the case 7 isreinforced improving its rigidness.

In addition, in the power electronic unit 1, as the first connectingconductor 81(N), the second connecting conductor 82(P), and the thirdconnecting conductors 83(U) to 85(W) are correspondingly extendedoutside of the case 7 in such a manner that they do not interfere witheach other, while an additional terminal board is omitted, particularly,the protruding ends of the first connecting conductor 81(N) and thesecond connecting conductor 82(P) correspondingly function as the firstpower input terminal 72 and the second power input terminal 73, and thusthey can be electronically connected with the battery.

[Configuration Related to Connecting Conductor]

As shown in FIG. 1, FIG. 3, and FIG. 4, the first connecting conductor81(N) is a current path where a relatively high electric current flows,and while efficiently using the gap portion within the internal space Sof the case 7, extends this gap portion in the x-axis direction, andextending out of the sidewall 71 of the case 7 through the penetrationhole 711, the protruding end is used as the first power input terminal72. On the first power input terminal 72, there is arranged a fasteninghole 815 having a female screw thread for fastening and supporting whileelectrically connecting the connection terminal of the electric wiringfrom the minus terminal of the battery.

Specifically, as shown in FIG. 3 in particular, the first connectingconductor 81(N) is, within the internal space S, appropriately distancedfrom the controlling IC 551 mounted on the circuit board 55 and itscontrol current path which is a current path of a relatively lowcurrent, positioned below the circuit board 55 in the verticaldirection, and in the horizontal direction, is a block structure havinga horizontal block portion that extends in the x-axis direction in thegap portion between a part within the internal space S of the firstsemiconductor module 2 and the first condenser 91 and the secondcondenser 92.

That is, the first connecting conductor 81(N) is, not a member having ashape such as a thin line or a board, and is configured as a prismaticlinear conductive block structure where the vertical cross-section inthe y-z plane is of a rectangular shape. The first connecting conductor81(N) itself is a block structure having enough volume and strength as asupport member to support the mounting and fastening of the power inputterminals corresponding to the first semiconductor elements 23(U) to25(W), and the corresponding connection terminals of the first condenser91 and the second condenser 92. Specifically, the first connectingconductor 81(N) is typically made of an aluminum alloy, and its aspectratio, which in its vertical cross-section is the ratio of its widthdimension in the y-axis direction and its thickness dimension in thez-axis direction, although dependant on the positioning and sizes of itsfastening holes, is configured within the approximate range of 1:5 and5:1.

As the first connecting conductor 81(N) is made of a conductive blockstructure and capable of securing plentiful measurements for fasteningunits, a total of three fastening holes 813 each having female screwthreads are arranged facing upward from its bottom surface, and a totalof two fastening holes 814 each having female screw threads are arrangedfacing downward from its top surface and upward from its bottom surface.The first power input terminal 251 of the first semiconductor element25(W) is, using a fastening member 811 such as screws, to the bottomsurface of the first connecting conductor 81(N) through the fasteningholes 813, mechanically fastened, supported, and also electricallyconnected. Similarly, the first power input terminal 231 of the firstsemiconductor element 23(U) and the first power input terminal 241 ofthe first semiconductor element 24(V) are, individually, using thefastening member 811 shown using like reference characters, to thebottom surface of the first connecting conductor 81(N) through thefastening holes 813 shown using like reference characters, mechanicallyfastened, supported, and also electrically connected. In such a case,the fastening member 811 is fastened with a fastening tool (not shown)such as a screw driver having a straight handle, inserted into theinternal space S through the penetration hole 211 of the first coolingmember 21. While the connection terminals 912 of the first condenser 91are mechanically fastened, supported, and also electrically connected tothe top surface of the first connecting conductor 81(N) using fasteningmembers 812 and the fastening holes 814, the connection terminals 922 ofthe second condenser 92 are mechanically fastened, supported, and alsoelectrically connected to the bottom surface of the first connectingconductor 81(N) using the fastening members 812 and the fastening holes814 each shown using like reference characters as those related to thefirst condenser 91.

In a case when the first connecting conductor 81(N) is configured as ablock structure, as its material, instead of using a copper alloy or aniron alloy usually considered, it is preferable to use an aluminumalloy.

The reason therefor is, when the first connecting conductor 81(N) ismade of a copper alloy, as the copper alloy is relatively superior inconductivity, the cross-sectional area perpendicular to the direction inwith the current flows can be made smaller, and due to its high cost, acabled structure having multiple thin lines or a bus bar shapedconfiguration with thin plates is likely to be used, thus eliminatingthe need to use a block structure. In such a case, the strength of thefirst connecting conductor 81(N) itself may not be enough to properlysupport the first power input terminals 231 to 251 of the firstsemiconductor elements 23(U) to 25(W) and the connection terminalscorresponding to the first condenser 91 and the second condenser 92, letalone the difficulty of directly arranging the fastening holes 813 and814 on itself. Furthermore, in this case, due to the smallercross-sectional area, its perimeter and outer surface area are alsosmaller, leading to possibilities of unnecessary effects on each nearbyelement caused by an increase in the inductance against the currentsflowing through the part, along with a reduction in the radiation ofheat generated by the currents flowing through the part.

On the other hand, when the first connecting conductor 81(N) is made ofan iron alloy, as the iron alloy is relatively inferior in conductivity,the cross-sectional area perpendicular to the direction in with thecurrent flows needs to be made larger, resulting in the use of aconfiguration having a large cross-sectional area. In such a case, thesize of the first connecting conductor 81(N) itself becomes too large,making it difficult to extend along the gap portion within the internalspace S, and attempting to extend this along the mentioned gap portionrequires the size of the case 7 itself to be larger.

Accordingly, for securing the performance while optimizingcharacteristics, such as electrical properties, mechanical properties,and the size thereof, of the first connecting conductor 81(N), in orderto configure the first connecting conductor 81(N) as a block structure,it can be evaluated that it is preferable that this conductive materialis made of an aluminum alloy. The above mentioned reasoning is the samewith the other conductors, the second connecting conductor 82(P) and thethird connecting conductors 83(U) to 85(W). Particularly, in the thirdconnecting conductors 83(U) to 85(W), as the first output terminals 232to 252 of the first semiconductor elements 23(U) to 25(W), the secondoutput terminals 332 to 352 of the second semiconductor elements 33(U)though 35(W), and the U-phase to W-phase drive current input terminalsof the electric motor can, to the third connecting conductors 83(U) to85(W) correspondingly, be directly connected and mechanically supportedtogether with being electrically connected, an additional terminal boardcan be omitted.

As shown in FIG. 1, FIG. 3, and FIG. 4, the second connecting conductor82(P) is a current path where a relatively high electric current flows,and except for being attached at a position higher than the firstconnecting conductor 81(N) and in an upside-down manner when compared tothe first connecting conductor 81(N), is a member identical to the firstconnecting conductor 81(N). That is, on the second connecting conductor82(P), similarly to the first connecting conductor 81(N), fasteningholes 823, 824, and 825 are arranged. In this case, the second powerinput terminal 331 of the second semiconductor element 33(U), the secondpower input terminal 341 of the second semiconductor element 34(V), andthe second power input terminal 351 of the second semiconductor element35(W) are, individually, using fastening members 821 shown using likereference characters, to the top surface of the second connectingconductor 82(P) to the fastening holes 823 shown using like referencecharacters, mechanically fastened, supported, and also electricallyconnected. While the connection terminals 911 of the first condenser 91are mechanically fastened, supported, and also electrically connected tothe top surface of the second connecting conductor 82(P) using fasteningmembers 822 and the fastening holes 824, the connection terminals 921 ofthe second condenser 92 are mechanically fastened, supported, and alsoelectrically connected to the bottom surface of the second connectingconductor 82(P) using the fastening members 822 and the fastening holes824 each shown using the like reference characters as those related tothe first condenser 91. The connection terminal of the electric wiringfrom the plus terminal of the battery is fastened, supported, and alsoelectrically connected to the fastening hole 825.

As shown in FIG. 1, FIG. 3, and FIG. 4, the third connecting conductor85(W) is a current path where a relatively high electric current flows,and in relation to the first connecting conductor 81(N) and the secondconnecting conductor 82(P), is arranged on the opposite side in they-axis direction, while a portion of the first semiconductor module 2positioned within the internal space S and portions of the circuit board55 and the second semiconductor module 3 positioned within the internalspace S are interposed therebetween, and while efficiently using the gapportion within the internal space S of the case 7, extends this gapportion in the y-axis direction, and extending out of the sidewall 71 ofthe case 7 through the penetration hole 713, the protruding end is usedas the output terminal 74. On the output terminal 74 of the thirdconnecting conductor 85(W), there is arranged a fastening hole 852having a female screw thread for mechanically fastening and supportingthe W-phase drive current input terminal of the electric motor.

Specifically, as shown in FIG. 3 in particular, the third connectingconductor 85(W) is, within the internal space S of the case 7,appropriately distanced from the controlling IC 551 mounted on thecircuit board 55 and its control current path which is a current path ofa relatively weak current. In the horizontal direction, the thirdconnecting conductor 85(W) extends from the sidewall 71 in the y-axisdirection around the gap portion leading to a part of the firstsemiconductor module 2 positioned within the internal space S, and has aprismatic and linear horizontal block portion where the verticalcross-section in the x-z plane is of a rectangular shape. In thevertical direction, the third connecting conductor 85(W) extends uprightfrom near the portion of the first semiconductor module 2 positionedwithin the internal space S, and while penetrating a correspondingpenetration hole 554 of the circuit board 55, as to bridge between thefirst output terminal 252 of the first semiconductor element 25(W) andthe second output terminal 352 of the second semiconductor element35(W), extends in the z-axis direction along the gap portion among theportion positioned within the internal space S of the firstsemiconductor module 2, the portion positioned within the internal spaceS of the circuit board 55 and the second semiconductor module 3, and thecurrent sensor 552, and has a block structure having a prismatic andlinear upright block portion, where the lateral cross-section in the x-yplane is of a rectangular shape, which joins the horizontal blockportion. Furthermore, the penetration holes 554 may be a single holethrough which all of the third connecting conductors 83(U) to 85(W) maybe inserted.

That is, the third connecting conductor 85(W), although being of anL-shape when viewed in the x-axis direction, similarly to the firstconnecting conductor 81(N) and the second connecting conductor 82(P), isconstituted by a conductive block structure made of an aluminum alloy,and its aspect ratio of its portion extending in the y-axis direction,which in its vertical cross-section in the x-z plane is the ratio of itswidth dimension in the x-axis direction and its thickness dimension inthe z-axis direction, and its aspect ratio of its portion extending inthe z-axis direction, which in its lateral cross-section in the x-yplane is the ratio of its width dimension in the x-axis direction andits depth dimension in the y-axis direction, are respectively configuredwithin the approximate range of 1:5 to 5:1.

As the third connecting conductor 85(W) is made of a conductive blockstructure and capable of securing plentiful measurements for fasteningunits, and capable of securing a plentiful length across from the secondsemiconductor element 35(W) to the first semiconductor element 25(W), onthe third connecting conductor 85(W), a top and bottom pair of fasteningholes 851 each having female screw threads can be arranged on theopposite side. Particularly as shown in FIG. 3, the second outputterminal 352 of the second semiconductor element 35(W), using fasteningmembers 855 and the fastening holes 851, is mechanically fastened,supported, and also electrically connected to the top end surface of theupright block portion of the third connecting conductor 85(W).Similarly, the first output terminal 252 of the first semiconductorelement 25(W), using the fastening members 855 and the fastening holes851 each shown using like reference characters, is mechanicallyfastened, supported, and also electrically connected to the bottom endsurface of the upright block portion of the third connecting conductor85(W). In this case, the fastening members 855 are fastened with afastening tool (not shown) such as a screw driver having a straighthandle, inserted into the internal space S through the correspondingpenetration hole 211 of the first cooling member 21 or the correspondingpenetration hole 311 of the second cooling member 31.

The third connecting conductor 84(V) adjacently placed on the side inthe negative x-axis direction in relation to the third connectingconductor 85(W), and the third connecting conductor 83(U) adjacentlyplaced on the side in the negative x-axis direction in relation to thethird connecting conductor 84(V) are each current paths where relativelyhigh currents flow, and except for their attached positions differingfrom the third connecting conductor 85(W), are members identical to thethird connecting conductor 85(W). That is, the third connectingconductor 83(U) and the third connecting conductor 84(V), similarly tothe third connecting conductor 85(W), while efficiently using the gapportion within the internal space S of the case 7 and extending this gapportion in the y-axis direction, extend out from the sidewall 71 of thecase 7, and these protruding ends are used as the output terminals 74.On the output terminals 74 of the third connecting conductor 83(U) andthe third connecting conductor 84(V), fastening holes 832 and 842 havingfemale screw threads are arranged to correspondingly mechanically fastenand support the U-phase and V-phase drive current input terminals of theelectric motor. In this case, while the second output terminal 332 ofthe second semiconductor element 33(U), using a fastening member 835 anda fastening hole 831 having a female screw thread, is mechanicallyfastened, supported, and also electrically connected to the top endsurface of the upright block portion of the third connecting conductor83(U), the first output terminal 232 of the first semiconductor element23(U), using a fastening member 835 and a fastening hole 831 having afemale screw thread each shown using like reference characters, ismechanically fastened, supported, and also electrically connected to thebottom end surface of the upright block portion of the third connectingconductor 83(U). While the second output terminal 342 of the secondsemiconductor element 34(V), using a fastening member 845 and afastening hole 841 having a female screw thread, is mechanicallyfastened, supported, and also electrically connected to the top endsurface of the upright block portion of the third connecting conductor84(V), the first output terminal 242 of the first semiconductor element24(V), using a fastening member 845 and a fastening hole 841 having afemale screw thread each shown using like reference characters, ismechanically fastened and supported while electrically connected to thebottom end surface of the upright block portion of the third connectingconductor 84(V). The U-phase drive current input terminal of theelectric motor, through the fastening hole 832 arranged on the outputterminal 74 of the third connecting conductor 83(U), is mechanicallyfastened, supported, and also electrically connected, and the V-phasedrive current input terminal of the electric motor, through thefastening hole 842 arranged on the output terminal 74 of the thirdconnecting conductor 84(V), is mechanically fastened, supported, andalso electrically connected.

The first connecting conductor 81(N), the second connecting conductor82(P), and the third connecting conductors 83(U) to 85(W) shall be blockstructure, capable of extending along corresponding gap portions withinthe internal space S and penetrating the sidewall 71 to protrude out ofthe case 7, having enough strength and volume to act as a supportingmember that supports while mechanically fastening to anothercorrespondingly mounted terminal, and having enough conductivity toconduct with another terminal. Therefore, the block structure mayinclude a single block portion, or may be a combination of a pluralityof block portions, and by appropriately combining similar blockportions, its shape and the length of the current path may be easilyexpanded. Furthermore, as long as the block portion has a cross-sectionthat does not generate excessive inductance or heat, the block portionis not limited to a shape having a rectangular cross-section, and mayhave a cross-section of such as another polygon or oval shape. Ofcourse, the block portion, instead of extending as a linear blockportion, may be a block portion extending in a curve shape, and insteadof having the fastening portion on a flat surface, may have a fasteningportion on an inclined surface.

As described above, additionally, in the power electronic unit 1, as thefirst connecting conductor 81(N), second connecting conductor 82(P), andthird connecting conductors 83(U) to 85(W) where relatively highcurrents flow, and the control current paths where relatively lowcurrents flow, are distanced from each other and distributedefficiently, the first connecting conductor 81(N), second connectingconductor 82(P), and third connecting conductors 83(U) to 85(W) arecorrespondingly extended in the gap portions of the internal space S,and the first connecting conductor 81(N), second connecting conductor82(P), and third connecting conductors 83(U) to 85(W) are configured asa block structure, the configuration of the entire device is keptcompact through the efficient use of the internal space S, and while anadditional terminal board is omitted, the first output terminals 232 to252 of the first semiconductor elements 23(U) to 25(W) are, to the thirdconnecting conductors 83(U) to 85(W), mechanically fastened, supported,and also electrically connected, and the second output terminals 332 to352 of the second semiconductor elements 33(U) to 35(W) are, to thethird connecting conductors 83(U) to 85(W), mechanically fastened,supported, and also electrically connected, while meanwhile, the U-phasedrive current input terminal of the electric motor is, to the thirdconnecting conductor 83(U), mechanically fastened, supported, and alsoelectrically connected, the V-phase drive current input terminal of theelectric motor is, to the third connecting conductor 84(V), mechanicallyfastened, electrically connected, and also supported while beingelectrically connected, and the W-phase drive current input terminal ofthe electric motor is, to the third connecting conductor 85(W),mechanically fastened, supported, and also electrically connected.

[Assembling of Power Electronic Unit]

A method of assembling the power electronic unit 1 having the aboveconfiguration is described below in detail.

The case 7 is first molded and prepared. Specifically, the thirdconnecting conductors 83(U) to 85(W) are located beforehand inpredetermined positions within the mold, and thereafter, the resinmaterial is injected into the mold. Subsequently, simultaneously as thesidewall 71 is molded, the third connecting conductors 83(U) to 85(W),in the penetration portions 713 formed in the sidewall 71, penetrate thesidewall 71. The injection of the resin material into the mold is thenended after being performed for a predetermined time, and when the moldis cooled, the third connecting conductors 83(U) to 85(W) are, in thepenetration portions 713 of the sidewall 71, adhered and fixed to thesidewall 71. Thereafter, by removing the molded product from the mold,the case 7, with the third connecting conductors 83(U) to 85(W) fixed tothe sidewall 71, is obtained.

First, the insulation sheet 22 is arranged on top of one side of thefirst cooling member 21, the surface 21A, the pressing member 42 isattached against the frame 41 accommodating the first semiconductorelements 23(U) to 25(W), and the circuit board 51 mounted with thedriving IC 511 is attached. By fastening and attaching the frame 41 inthe state described above onto one side of the first cooling member 21,the surface 21A, with the insulation sheet 22 in between, the firstsemiconductor module 2 is assembled.

At this time, through one pair of positioning holes 512 of the circuitboard 51, a total of two positioning pins 412 and 413 arranged uprighton the frame body 411 of the frame 41 are correspondingly inserted, andthus the circuit board 51 is positioned against the frame 41, andattached to a specific position in the first semiconductor module 2.

Similarly, the insulation sheet 32 is arranged on top of one side of thesecond cooling member 31, the surface 31A, the pressing member 44 isattached against the frame 43 accommodating the second semiconductorelements 33(U) to 35(W), and the circuit board 52 mounted with thedriving IC 521 is attached. By fastening and attaching the frame 43 inthe state described above onto one side of the second cooling member 31,the surface 31A, with the insulation sheet 32 in between, the secondsemiconductor module 3 is assembled.

At this time, through one pair of positioning holes 522 of the circuitboard 52, a total of two positioning pins 432 and 433 arranged uprighton the frame body 431 of the frame 43 are correspondingly inserted, andthus the circuit board 52 is positioned against the frame 43, andattached to a specific position in the second semiconductor module 3.

In addition, the first connecting conductor 81(N) penetrated through thepenetration hole 711 through a sealing member and the second connectingconductor 82(P) penetrated through the penetration hole 712 through asealing member are respectively attached to corresponding fixing parts(not shown) arranged on the sidewall 71 of the case 7.

Furthermore, to the first connecting conductor 81(N) and the secondconnecting conductor 82(P) in the above mentioned state, each using thecorresponding fastening members 812 and 822 along with the fasteningholes 814 and 824, the connection terminals 911 and 912 of the firstcondenser 91, and the connection terminals 921 and 922 of the secondcondenser 92, are fastened. With this configuration, the first condenser91 and the second condenser 92, while being accommodated in the internalspace S of the case 7, are attached to the first connecting conductor81(N) and the second connecting conductor 82(P).

Next, with the case 7 in the state described above, with the firstsemiconductor module 2, the first semiconductor elements 23(U) to 25(W)are positioned within the internal space S through the first opening7H1, and attached in such a manner that the other surface of the firstcooling member 21, the surface 21B, is exposed to outside of the case 7,as to close the first opening 7H1 with the first cooling member 21.

At this time, by inserting the positioning pins 412 and 413 of the firstsemiconductor module 2 through the corresponding pair of positioningholes 555 of the circuit board 55, the circuit board 55, while beingplaced on a fixing part (for which reference numeral is not assigned),arranged above the circuit board 51 on the sidewall 71 of the case 7, ispositioned against the first semiconductor module 2 attached to the case7.

Next, with the case 7 in the state described above, with the secondsemiconductor module 3, the second semiconductor elements 33(U) to 35(W)are arranged within the internal space S through the second opening 7H2,and attached in such a manner that the other surface of the secondcooling member 21, the surface 31B, is exposed to outside of the case 7,so as to close the second opening 7H2 with the second cooling member 31.

At this time, by inserting the positioning pins 432 and 433 of thesecond semiconductor module 3 through the remaining corresponding pairof positioning holes 555 of the circuit board 55, while the circuitboard 55 and the second semiconductor module 3 are positioned, thecircuit board 55 is attached to a fixing part in the case 7.

Next, while sequentially inserting a fastening tool (not shown) into theinternal space S through the penetration hole 211 of the first coolingmember 21, by fastening the fastening members 811 onto the correspondingfastening holes 813, the first power input terminals 231 to 251 of thefirst semiconductor elements 23(U) to 25(W) are fastened against thefirst connecting conductor 81(N), and by fastening the fastening members835 to 855 onto the corresponding fastening holes 831 to 851, the firstoutput terminals 232 to 252 of the first semiconductor elements 23(U) to25(W) are fastened against the third connecting conductors 83(U) to85(W).

Next, while sequentially inserting a fastening tool (not shown) into theinternal space S through the penetration hole 311 of the second coolingmember 31, by fastening the fastening members 821 onto the correspondingfastening holes 823, the second power input terminals 331 to 351 of thesecond semiconductor elements 33(U) to 35(W) are fastened against thesecond connecting conductor 82(P), and by fastening the fasteningmembers 835 to 855 onto the corresponding fastening holes 831 to 851,the second power output terminals 332 to 352 of the second semiconductorelements 33(U) to 35(W) are fastened against the third connectingconductors 83(U) to 85(W).

Subsequently, according to need, by closing the penetration hole 211 ofthe first cooling member 21 and the penetration hole 311 of the secondcooling member 31 using such as grommets (not shown), the assembly ofthe power electronic unit 1 is completed.

Second Embodiment

Next, a semiconductor control device according to a second embodiment ofthe present invention is described in detail also with reference to FIG.5 to FIG. 7.

A semiconductor device 1′ according to the present embodiment shown infurther detail in FIG. 5 to FIG. 7B is, mainly different from that ofthe first embodiment for configurations of a first connecting conductor81(N)′ and a second connecting conductor 82(P)′ being different, whilethe configuration of the rest remains the same. Therefore, in thepresent embodiment, the explanation will focus on the differences, andexplanations of identical configurations are denoted by like referencecharacters and are abbreviated or omitted for convenience. Furthermore,with the present embodiment, a configuration, where the third connectingconductors 83(U) to 85(W) extend outside of the case 7 correspondinglyto a total of three penetration holes 713′ arranged on the sidewall 71,sealing members are arranged in the gaps between the third connectingconductors 83(U) to 85(W) and the corresponding penetration holes 713′,and the internal space S is sealed, is used. However, this is not alimitation, and a configuration, where, similarly to the firstembodiment, the third connecting conductors 83(U) to 85(W) areintegrally formed at the total of three penetration portions 713arranged on the sidewall 71, and extend outside of the case 7correspondingly through these, may be used.

Specifically, the arrangement positions of each of fastening holes 813′and 814′ of the first connecting conductor 81(N)′ and the arrangementpositions of each of fastening holes 823′ and 824′ of the secondconnecting conductor 82(P)′ differ from those of the first embodiment,and correspondingly, the arrangement positions of each of first powerinput terminals 231′ to 251′ of first semiconductor elements 23(U)′ to25(W)′, the arrangement positions of each of the second power inputterminals 331′ to 351′ of second semiconductor elements 33(U)′ to35(W)′, the arrangement positions of each of connection terminals 911′and 912′ of a first condenser 91′, and the arrangement positions of eachof connection terminals 921′ and 922′ of a second condenser 92′, differfrom those of the first embodiment.

That is, regarding the relative positioning relation, in the x-axisdirection, of the first connecting conductor 81(N)′ and the secondconnecting conductor 82(P)′, as the second connecting conductor 82(P)′is positioned above the first connecting conductor 81(N)′, and thefastening hole 814′ on the side of the upper surface of the firstconnecting conductor 81(N)′ is arranged to deviate from the negativex-axis direction end of the second connecting conductor 82(P)′ in thenegative x-axis direction, even after the first connecting conductor81(N)′ and the second connecting conductor 82(P)′ are fixed to the case7, the fastening member 812 corresponding to the fastening hole 814′ canbe fastened from the upper side using a fastening tool (not shown) suchas a screw driver having a straight handle. In addition, similarly, asthe fastening hole 824′ on the side of the lower surface of the secondconnecting conductor 82(P)′ is arranged to deviate from the positivex-axis direction end of the first connecting conductor 81(N)′ in thepositive x-axis direction, even after the first connecting conductor81(N)′ and the second connecting conductor 82(P)′ are fixed to the case7, the fastening member 822 corresponding to the fastening hole 824′ canbe fastened from the lower side using a fastening tool (not shown) suchas a screw driver having a straight handle.

The first condenser 91′ and the second condenser 92′ are, in relation toeach of the first semiconductor elements 23(U)′ to 25(W)′ and the secondsemiconductor elements 33(U)′ to 35(W)′, electrically connected in sucha manner that the overall connection paths from the first condenser 91′and the second condenser 92′ are equivalent.

Specifically, the sum of the distance from the first condenser 91′ tothe second semiconductor element 33(U)′ via a connection terminal 911′,the second connecting conductor 82(P)′ and the second power inputterminal 331′, and the distance from the second condenser 92′ to thesecond semiconductor element 33(U)′ via a connection terminal 921′, thesecond connecting conductor 82(P)′, and the second power input terminal331′, the sum of the distance from the first condenser 91′ to the secondsemiconductor element 34(V)′ via the connection terminal 911′, thesecond connecting conductor 82(P)′, and a second power input terminal341′, and the distance from the second condenser 92′ to the secondsemiconductor element 34(V)′ via the connection terminal 921′, thesecond connecting conductor 82(P)′, and the second power input terminal341′, the sum of the distance from the first condenser 91′ to the secondsemiconductor element 35(W)′ via the connection terminal 911′, thesecond connecting conductor 82(P)′, and a second power input terminal351′, and the distance from the second condenser 92′ to the secondsemiconductor element 35(W)′ via the connection terminal 921′, thesecond connecting conductor 82(P)′, and the second power input terminal351′, the sum of the distance from the first condenser 91′ to the firstsemiconductor element 23(U)′ via the connection terminal 912′, the firstconnecting conductor 81(N)′, and a first power input terminal 231′, andthe distance from the second condenser 92′ to the first semiconductorelement 23(U)′ via a connection terminal 922′, the first connectingconductor 81(N)′, and the first power input terminal 231′, the sum ofthe distance from the first condenser 91′ to the first semiconductorelement 24(V)′ via the connection terminal 912′, the first connectingconductor 81(N)′, and a first power input terminal 241′, and thedistance from the second condenser 92′ to the first semiconductorelement 24(V)′ via the connection terminal 922′, the first connectingconductor 81(N)′, and the first power input terminal 241′, and the sumof the distance from the first condenser 91′ to the first semiconductorelement 25(W)′ via the connection terminal 912′, the first connectingconductor 81(N)′, and a first power input terminal 251′, and thedistance from the second condenser 92′ to the first semiconductorelement 25(W)′ via the connection terminal 922′, the first connectingconductor 81(N)′, and the first power input terminal 251′, areconfigured to be equal to each other.

Furthermore, as described above, in the power electronic unit 1′, as thefirst condenser 91′ and the second condenser 92′ are each electricallyconnected in a parallel manner with each other between the firstconnecting conductor 81(N)′ and the second connecting conductor 82(P)′,the fastening hole 814′ on the side of the upper surface of the firstconnecting conductor 81(N)′ is arranged to deviate from the negativex-axis direction end of the second connecting conductor 82(P)′ in thenegative x-axis direction, and the fastening hole 824′ on the side ofthe lower surface of the second connecting conductor 82(P)′ is arrangedto deviate from the positive x-axis direction end of the firstconnecting conductor 81(N)′ in the positive x-axis direction, even afterthe first connecting conductor 81(N)′ and the second connectingconductor 82(P)′ are fixed to the case 7, the fastening members 812 and822 corresponding to the fastening holes 814′ and 824′ can be easilyfastened. In addition, as the first condenser 91′ and the secondcondenser 92′ are, in relation to each of the first semiconductorelements 23(U)′ to 25(W)′ and the second semiconductor elements 33(U)′to 35(W)′, connected electrically and in parallel via the firstconnecting conductor 81(N)′ and the second connecting conductor 82(P)′in such a manner that each of the overall connection paths from thefirst condenser 91′ and the second condenser 92′ are equivalent, thecontributions of the first condenser 91′ and the second condenser 92′ inrelation to these are kept even, evenly smoothing out the direct currentfrom the battery to the first semiconductor elements 23(U)′ to 25(W)′and the second semiconductor elements 33(U)′ to 35(W)′.

A method of assembling the power electronic unit 1′ having the aboveconfiguration is explained below in detail.

In the present embodiment, without fixing the third connectingconductors 83(U) to 85(W) onto the sidewall 71 of the case 7 beforehand,similarly to the first embodiment, the first semiconductor module 2 isassembled as the second semiconductor module 3 is assembled.

In addition, the first connecting conductor 81(N)′ penetrating thepenetration hole 711 through the sealing member, the second connectingconductor 82(P)′ penetrating the penetration hole 712 through thesealing member, and the third connecting conductors 83(U) to 85(W)correspondingly penetrating the penetration holes 713′ through thesealing members are each attached to corresponding fixations (not shown)arranged on the sidewall 71 of the case 7.

Furthermore, with the first connecting conductor 81(N)′ and the secondconnecting conductor 82(P)′ in the state described above, by fasteningthe connection terminals 911′ and 912′ of the first condenser 91′ andthe connection terminals 921′ and 922′ of the second condenser 92′,using each of the corresponding fastening members 812 and 822, and thefastening holes 814′ and 824′, the first condenser 91′ and the secondcondenser 92′, while being accommodated within the internal space S ofthe case 7, are attached to the first connecting conductor 81(N)′ andthe second connecting conductor 82(P)′.

At this time, as the fastening hole 814′ on the side of the uppersurface of the first connecting conductor 81(N)′ is arranged to deviatefrom the negative x-axis direction end of the second connectingconductor 82(P)′ in the negative x-axis direction, and the fasteninghole 824′ on the side of the lower surface of the second connectingconductor 82(P)′ is arranged to deviate from the positive x-axisdirection end of the first connecting conductor 81(N)′ in the positivex-axis direction, the fastening members 812 and 822 corresponding to allof the fastening holes 814′ and 824′ are fastened using a fastening tool(not shown) such as a screw driver having a straight handle.

Next, similarly to the first embodiment, with the case 7 in the statedescribed above, in the first semiconductor module 2, the firstsemiconductor elements 23(U)′ to 25(W)′ are then positioned within theinternal space S through the first opening 7H1, and attached in such amanner that the other surface 21B of the first cooling member 21, thesurface 21B, is exposed outside of the case 7, as to close the firstopening 7H1 with the first cooling member 21, and in the secondsemiconductor module 3, the second semiconductor elements 33(U)′ to35(W)′ are arranged within the internal space S through the secondopening 7H2, and attached in such a manner that the other surface 31B ofthe second cooling member 31, the surface 31B, is exposed outside of thecase 7, as to close the second opening 7H2 with the second coolingmember 31.

Next, similarly to the first embodiment, while sequentially inserting afastening tool (not shown) into the internal space S through thepenetration hole 211 of the first cooling member 21, by fastening thefastening members 811 onto the corresponding fastening holes 813′, thefirst power input terminals 231′ to 251′ of the first semiconductorelements 23(U)′ to 25(W)′ are fastened to the first connecting conductor81(N)′, and by fastening the fastening members 835 to 855 onto thecorresponding fastening holes 831 to 851, the first output terminals 232to 252 of the first semiconductor elements 23(U)′ to 25(W)′ are fastenedto the third connecting conductors 83(U) to 85(W).

Next, similarly to the first embodiment, while sequentially inserting afastening tool (not shown) into the internal space S through thepenetration hole 311 of the second cooling member 31, by fastening thefastening members 821 onto the corresponding fastening holes 823′, thesecond power input terminals 331′ to 351′ of the second semiconductorelements 33(U)′ to 35(W)′ are fastened to the second connectingconductor 82(P)′, and by fastening the fastening members 835 to 855 ontothe corresponding fastening holes 831 to 851, the second outputterminals 332 to 352 of the second semiconductor elements 33(U)′ to35(W)′ are fastened to the third connecting conductors 83(U) through85(W).

Similarly to the first embodiment, as needed, by closing the penetrationhole 211 of the first cooling member 21 and the penetration hole 311 ofthe second cooling member 31 using such as grommets (not shown), theassembly of the power electronic unit 1′ is completed.

In the present invention, the shape, arrangement, and number or the likeof constituent elements are not limited to those described in the aboveembodiments, and it is of course possible to appropriately modify theconstituent elements without departing from the scope of the invention,such as replacing these elements with other ones that have identicaloperational effects.

As described above, because the present invention is capable ofproviding a semiconductor device capable of mechanically fastening,supporting, and also electrically connecting output terminals of thesemiconductor element to input terminals of external devices and inputterminals of the semiconductor element to connection terminals ofrelated devices, while omitting an additional terminal board, for itsgeneral purpose and universal characteristics, its application can beexpected in a wide range in fields of semiconductor devices, such as apower electronic unit.

Reference is hereby made to a Patent Application No. TOKUGAN 2011-210651with a filing date of Sep. 27, 2011 in Japan, and a Patent ApplicationNo. TOKUGAN 2011-210652 with a filing date of Sep. 27, 2011 in Japan,the entire contents of which are incorporated herein by reference.

The present invention is not limited to the embodiments described abovein respect of a kind, placement and the number of the component partsand it is of course to be understood that the relevant component partsmay be suitably replaced by those having equivalent advantageous effectsand alterations may be suitably made without departing from the scope ofthe present invention, in light of the teachings. The scope of theinvention is defined with reference to the following claims.

What is claimed is:
 1. A semiconductor device comprising: asemiconductor element; and a connecting conductor that electricallyconnects at least one of an input terminal and an output terminal of thesemiconductor element to a connection terminal of an electronic device,wherein the connecting conductor is a block structure.
 2. Thesemiconductor device according to claim 1, wherein the connectingconductor is the block structure that electrically connects an outputterminal of the semiconductor element to a connection terminal of anexternal device.
 3. The semiconductor device according to claim 2,further comprising: a resin case that accommodates the semiconductorelement, wherein the connecting conductor is integrally formed with thecase and fixed to the case.
 4. The semiconductor device according toclaim 2, wherein the connecting conductor includes a screw fasteningunit that fastens the output terminal or the connection terminal.
 5. Thesemiconductor device according to claim 2, wherein the connectingconductor is made of an aluminum material.
 6. The semiconductor deviceaccording to claim 1, further comprising: a condenser that iselectrically connected to the semiconductor element, wherein theconnecting conductor includes a plurality of connecting conductors, andthe plurality of connecting conductors electrically connect an inputterminal of the semiconductor element to a connection terminal of thecondenser.
 7. The semiconductor device according to claim 6, wherein theplurality of connecting conductors include a first connecting conductorand a second connecting conductor that is arranged to deviate from thefirst connecting conductor.
 8. The semiconductor device according toclaim 6, wherein each of the plurality of connecting conductors includesa screw fastening unit that fastens the input terminal or the connectionterminal.
 9. The semiconductor device according to claim 6, wherein theplurality of connecting conductors are made of an aluminum material.